Wafer bonding method and apparatus with curved surfaces

ABSTRACT

An apparatus for and a method of bonding a first substrate and a second substrate are provided. In an embodiment a first wafer chuck has a first curved surface and a second wafer chuck has a second curved surface. A first wafer is placed on the first wafer chuck and a second wafer is placed on a second wafer chuck, such that both the first wafer and the second wafer are pre-warped prior to bonding. Once the first wafer and the second wafer have been pre-warped, the first wafer and the second wafer are bonded together.

PRIORITY CLAIM AND CROSS-REFERENCE

This application is a continuation of U.S. application Ser. No.15/830,482, entitled “Wafer Processing Method and Apparatus,” filed onDec. 4, 2017, which is a continuation of U.S. application Ser. No.14/163,460, entitled “Wafer Processing Method and Apparatus,” filed onJan. 24, 2014, now U.S. Pat. No. 9,837,291 issue on Dec. 5, 2017, whichapplications are hereby incorporated herein by reference.

BACKGROUND

Semiconductor devices are used in a variety of electronic applications,such as personal computers, cell phones, digital cameras, and otherelectronic equipment, as examples. Semiconductor devices are typicallyfabricated by sequentially depositing insulating or dielectric layers,conductive layers, and semiconductive layers of material over asemiconductor substrate, and patterning the various material layersusing lithography to form circuit components and elements thereon.

The semiconductor industry continues to improve the integration densityof various electronic components (e.g., transistors, diodes, resistors,capacitors, etc.) by continual reductions in minimum feature size, whichallow more components to be integrated into a given area. These smallerelectronic components also require smaller packages that utilize lessarea than packages of the past, in some applications.

Some methods of forming semiconductor devices involve bonding togethertwo wafers. The wafers may be bonded together using fusion bonding,eutectic bonding, and hybrid bonding, as examples.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present embodiments, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawings, in which:

FIG. 1 illustrates a wafer bonding system in accordance with anembodiment;

FIG. 2 illustrates a placement of a first wafer and a second wafer intothe wafer bonding system in accordance with an embodiment;

FIG. 3 illustrates an initiation of a bonding process in accordance withan embodiment;

FIG. 4 illustrates an ending of a bonding process in accordance with anembodiment; and

FIG. 5 illustrates an alignment measuring process in accordance with anembodiment.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the variousembodiments and are not necessarily drawn to scale.

DETAILED DESCRIPTION

The making and using of the present embodiments are discussed in detailbelow. It should be appreciated, however, that the present disclosureprovides many applicable inventive concepts that can be embodied in awide variety of specific contexts. The specific embodiments discussedare merely illustrative of specific ways to make and use respectiveembodiments, and do not limit the scope of the present disclosure.

FIG. 1 illustrates a wafer bonding system 100 with a first wafer chuck101 and a second wafer chuck 103 that can be positioned to face eachother. In an embodiment the first wafer chuck 101 and the second waferchuck 103 are used to bond a first semiconductor wafer 201 (notillustrated in FIG. 1 but illustrated and discussed below with respectto FIG. 2) to a second semiconductor wafer 203 (also not illustrated inFIG. 1 but illustrated and discussed below with respect to FIG. 2). Inan embodiment the first wafer chuck 101 has a first curved surface 105that has a series of first openings 107 along the length of the firstsurface.

In an embodiment the first wafer chuck 101 comprises any suitablematerial that may be processed to have the first openings 107 along thefirst curved surface 105. In an embodiment, for example, silicon basedmaterials, such as glass, silicon oxide, silicon nitride, or othermaterials, such as aluminum oxide, combinations of any of thesematerials, or the like may be used. Additionally, the first wafer chuck101 may have a diameter that is suitable to hold the first semiconductorwafer 201. As such, while the size of the first wafer chuck 101 will bein some ways dependent upon the size of the first semiconductor wafer201, the first wafer chuck 101 can have a first distance D₁ of about 250mm and about 300 mm, while the first curved surface 105 may extend awayfrom the remainder of the first wafer chuck 101 a second distance D₂ ofbetween about 0 μm and about 20 μm. Additionally, the first curvedsurface 105 of the first wafer chuck 101 may have a curvature of betweenabout 0 μm and about 20 μm in order to induce a warpage in the firstsemiconductor wafer 201 when the first semiconductor wafer 201 is placedon the first wafer chuck 101. In a specific example, the first curvedsurface 105 has a deformation of about 3 μm from the center of the firstwafer chuck 101 to the edge of the first wafer chuck 101.

In an embodiment the first openings 107 are connected to a vacuum pump111. During operation the vacuum pump 111 will evacuate any gases fromthe first openings 107, thereby lowering the pressure within the firstopenings 107. When the first semiconductor wafer 201 is placed againstthe first curved surface 105 and the pressure within the first openings107 has been reduced by the vacuum pump 111, the pressure differencebetween the side of the first semiconductor wafer 201 facing the firstopenings 107 and the side of the first semiconductor wafer 201 facingaway from the first openings 107 will hold the first semiconductor wafer201 against the first curved surface 105. Additionally, the pressuredifference will also warp the first semiconductor wafer 201 into asimilarly curved shape as the first curved surface 105.

In an alternative embodiment, the first wafer chuck 101 may comprise aflat surface (not illustrated in FIG. 1) rather than the curved surface105. In this embodiment, the first wafer chuck 101 may utilize a pinthat extends through the first wafer chuck 101 in order to warp thefirst semiconductor wafer 201 after the first semiconductor wafer 201has been attached to the first wafer chuck 101.

The second wafer chuck 103 may be similar to the first wafer chuck 101,and may have a second curved surface 113, second openings 115 to thesecond curved surface 113, and a second vacuum pump 117. In anembodiment the second curved surface 113 may be similar to the firstcurved surface 105, although alternatively the second curved surface 113may have different dimensions from the first curved surface 105.Similarly, the second openings 115 may be similar to the first openings107, and may also be used to hold and warp the second semiconductorwafer 203 to the second wafer chuck 103.

In an embodiment, however, the second curved surface 113 of the secondwafer chuck 103 has a smaller curvature than the first curved surface105 of the first wafer chuck 101. For example, the second wafer chuck103 may have a third distance D₃ of between about 250 mm and about 300mm, while the second curved surface 113 may extend out from theremainder of the second wafer chuck 103 a fourth distance D₄ of betweenabout 30 μm and about 70 μm. In a specific example, the second curvedsurface 113 has a deformation of less than about 2 μm from the center ofthe second wafer chuck 103 to the edge of the second wafer chuck 103.

A motor 110 may be coupled to each of the first wafer chuck 101 and thesecond wafer chuck 103 in some embodiments. One motor 110 may be coupledto both the first wafer chuck 101 and the second wafer chuck 103 inother embodiments. The motor 110 comprises a piezoelectric motor or alinear motor in some embodiments. Alternatively, the motor 110 maycomprise other types of motors. The motor 110 is adapted to adjust an xposition, a y position, a z position, and/or an angular position (θ) ofthe first semiconductor wafer 201 and/or the second semiconductor wafer203 in some embodiments.

In some embodiments, the wafer bonding system 100 further comprises athermal controller 112 for thermally controlling the first semiconductorwafer 201 or the second semiconductor wafer 203. The thermal controller112 for thermally controlling the first semiconductor wafer 201 or thesecond semiconductor wafer 203 may be coupled to the second wafer chuck103, or the thermal controller 112 for thermally controlling the firstsemiconductor wafer 201 or the second semiconductor wafer 203 may becoupled to the first wafer chuck 101. In embodiments wherein the thermalcontroller 112 for thermally controlling the first semiconductor wafer201 or the second semiconductor wafer 203 is coupled to the second waferchuck 103, the thermal controller 112 is adapted to thermally controlthe second semiconductor wafer 203, as an example. In embodimentswherein the thermal controller 112 is coupled to the first wafer chuck101, the thermal controller 112 is adapted to thermally control thefirst semiconductor wafer 201, as another example. In some embodiments,a thermal controller 112 is coupled to the first wafer chuck 101, and athermal controller 112 is also coupled to the second wafer chuck 103, asyet another example. The thermal controller 112 for thermallycontrolling the first semiconductor wafer 201 or the secondsemiconductor wafer 203 is adapted to control a temperature of the firstsemiconductor wafer 201 and/or the second semiconductor wafer 203 to atemperature of about 20 degrees Celsius (C.) to about 25 degrees C. +/−about 2.0 degrees C. with about a 0.05 degrees C. resolution, in someembodiments. Alternatively, the thermal controller 112 is adapted tocontrol wafer temperature at other temperature ranges and tolerances, inother embodiments. In some embodiments, a thermal controller 112 forthermally controlling the first semiconductor wafer 201 or the secondsemiconductor wafer 203 temperatures is not included for the waferbonding system 100.

The thermal controller 112 comprises a thermal couple or a thermal platein some embodiments. Alternatively, the thermal controller 112 maycomprise other devices or instruments adapted to control the firstsemiconductor wafer 201 or the second semiconductor wafer 203temperature. Including the thermal controller 112 and heating the firstsemiconductor wafer 201 or the second semiconductor wafer 203 during thebonding process decreases or eliminates intrinsic run-out, e.g., thefirst semiconductor wafer 201 or the second semiconductor wafer 203difference wherein alignment can become worse of bonded wafers from thecenter to the edge, in some embodiments.

Additionally, in an embodiment an alignment monitor 108 is connected tothe motor 110 using, e.g., wiring (not individually illustrated in FIG.1). The alignment monitor 108 can emit infrared (IR) energy towards andthrough, e.g., the first wafer chuck 101 in order to check the alignmentof the first semiconductor wafer 201 and the second semiconductor wafer203. This information may then be passed to the motor 110 in order toperform any corrections that may be desired prior to the completedbonding of the first semiconductor wafer 201 and the secondsemiconductor wafer 203.

FIG. 2 illustrates a placement of the first semiconductor wafer 201 ontothe first wafer chuck 101. The first semiconductor wafer 201 maycomprise a semiconductor substrate, e.g., bulk silicon, doped orundoped, or a layer of a silicon-on-insulator (SOI) substrate.Generally, an SOI substrate comprises a layer of a semiconductormaterial such as silicon, germanium, silicon germanium, SOI, silicongermanium on insulator (SGOI), or combinations thereof. Other substratesthat may be used include multi-layered substrates, gradient substrates,or hybrid orientation substrates.

Additionally, the first semiconductor wafer 201 may also comprisedielectric and metallization layers over the semiconductor substrate inorder to form a plurality of dies on the first semiconductor wafer 201.These dies may be any suitable type of die, such as anapplication-specific integrated circuit (ASIC) device. However, anyother suitable type of devices, such as system on a chip type ofdevices, may alternatively be utilized.

The second semiconductor wafer 203 may be similar to the firstsemiconductor wafer 201, such as by comprising, e.g., a semiconductorsubstrate such as bulk silicon, a layer of an SOI substrate, or thelike. Alternatively, the second semiconductor wafer 203 may be aninsulative layer on a semiconductor layer that will be bonded to thefirst semiconductor wafer 201 in order to form an SOI substrate. Anysuitable combination of materials that are desired to be bonded togethermay alternatively be utilized, and all such combinations are fullyintended to be included within the scope of the embodiments.

Additionally, the second semiconductor wafer 203 may also comprisedielectric and metallization layers over the semiconductor substrate inorder to form a plurality of dies on the second semiconductor wafer 203.These dies may be any suitable type of die, such as an ASIC device.However, any other suitable type of devices, such as system on a chiptype of devices, may alternatively be utilized.

In a specific embodiment the first semiconductor wafer 201 may comprisea wafer with a plurality of ASIC dies that have been manufactured fromthe semiconductor substrate. Additionally, the second semiconductorwafer 203 may comprise a wafer with system on a chip (SOC) devices on itthat are desired to be bonded to the ASIC dies on the firstsemiconductor wafer 201.

Additionally, in an embodiment the first semiconductor wafer 201 furtherhas first alignment marks 205 and the second semiconductor wafer 203 hassecond alignment marks 207. The first alignment marks 205 and the secondalignment marks 207 may be formed in the first semiconductor wafer 201and the second semiconductor wafer 203 using a patterning process. Thefirst alignment marks 205 and the second alignment marks 207 will beused to assist in the positioning of the first semiconductor wafer 201and the second semiconductor wafer 203.

Optionally, before placing the first semiconductor wafer 201 on thefirst wafer chuck 101 and placing the second semiconductor wafer 203 onthe second wafer chuck 103, in some embodiments the first semiconductorwafer 201 and/or the second semiconductor wafer 203 are exposed to aplasma process. The plasma process activates the wafer surface andfacilitates the bonding process. In some embodiments, the firstsemiconductor wafer 201 and/or the second semiconductor wafer 203 arecleaned after the plasma process. The cleaning process may compriseusing cleaning arms, a drain system, and a spin module to keep the wafersurface clean and activated, as examples. A cleaning solvent includingdeionized (DI) water, acid, and/or alkalinity can be used toremove/protect the bonding surface, for example. Alternatively, othercleaning solvents and processes may be used. The plasma process and/orthe cleaning process are not included in the bonding process flow insome embodiments.

In an embodiment the first semiconductor wafer 201 is placed onto thefirst wafer chuck 101 in a planar condition. Once in place on the firstwafer chuck 101, the vacuum pump 111 is initiated, lowering the pressurewithin the first openings 107, holding the first semiconductor wafer 201to the first wafer chuck 101, and warping the first semiconductor wafer201 into a warped, non-planar shape. Optionally, a small force may beapplied to the first semiconductor wafer 201 to help mold the firstsemiconductor wafer 201 to the first wafer chuck 101 and position thefirst semiconductor wafer 201 against all of the first openings 107.

FIG. 2 also illustrates a placement of the second semiconductor wafer203 against the second wafer chuck 103. Similar to the placement of thefirst semiconductor wafer 201, the second semiconductor wafer 203 may beplaced adjacent to the second wafer chuck 103 and the second vacuum pump117 is initiated to lower the pressure within the second openings 115.With the pressure lowered within the second openings 115, the secondsemiconductor wafer 203 will be warped into the same shape as the secondcurved surface 113. Also, if desired, a small force may be applied tothe second semiconductor wafer 203 in order to position each part of thesecond semiconductor wafer against the second openings 115.

The alignment monitor 108 and the motor 110 are electrically connectedtogether by wiring (not individually illustrated in FIG. 1). In anembodiment the alignment monitor 108 is activated to emit the IR energy125 towards and through the first wafer chuck 101, the firstsemiconductor wafer 201, and the first alignment marks 205 on the firstsemiconductor wafer 201 to the second alignment marks 207 on the secondsemiconductor wafer 203. The motor 110 receives the informationregarding the location of the second semiconductor wafer 203 from thealignment monitor 108 and adjusts the position of the secondsemiconductor wafer 203 relative to the position of the firstsemiconductor wafer 201 to perform an initial alignment of the firstsemiconductor wafer 201 and the second semiconductor wafer 203.

If desired, a fine alignment may optionally be performed using thealignment monitor 108 which continues to emit IR energy 125 and themotor 110. Such a fine alignment may be utilized to ensure that thefirst alignment marks 205 and the second alignment marks 207 are alignedwith each other after the coarse alignment described above.

FIG. 3 illustrates an initiating of a bonding process to bond the firstsemiconductor wafer 201 and the second semiconductor wafer 203. In anembodiment the first wafer chuck 101 and the second wafer chuck 103 aremoved (e.g., by the motor 110) relative to each other such that thefirst alignment marks 205 and the second alignment marks 207 are alignedwith each other. Once aligned, the first semiconductor wafer 201 (whichhas been pre-warped) and the second semiconductor wafer 203 (which hasalso been pre-warped) are brought into contact a first point P₁. Once incontact, the first semiconductor wafer 201 and the second semiconductorwafer 203 will begin to bond at the first point P₁.

Once in contact, the first wafer chuck 101 and the second wafer chuck103 are used to apply pressure between the first semiconductor wafer 201and the second semiconductor wafer 203. In an embodiment the pressuremay be between about 50 mN and about 1,000 mN. Additionally, if desired,heat may be added using the thermal controller 112. In an embodiment thetemperature may be controlled between about 20° C. and about 25° C.,although any suitable temperature that can be used to aid in the bondingprocess may alternatively be used.

As the pressure is applied to the now-contacted first semiconductorwafer 201 and the second semiconductor wafer 203, the firstsemiconductor wafer 201 and the second semiconductor wafer 203 will bondtogether at each point where the first semiconductor wafer 201 comesinto contact with the second semiconductor wafer 203. As both the firstsemiconductor wafer 201 and the second semiconductor wafer 203 arepre-warped in different directions, this pressure will cause the bondingto proceed in a wave from the first point P₁ and moving outwards towardsthe edges of the first semiconductor wafer 201 and the secondsemiconductor wafer 203.

FIG. 4 illustrates a removal of the first wafer chuck 101 from the nowbonded first semiconductor wafer 201 and the second semiconductor wafer203. In an embodiment the first wafer chuck 101, in which the vacuum hasbeen removed, is moved by the motor 110 away from the bonded firstsemiconductor wafer 201 and the second semiconductor wafer 203, leavingthe bonded first semiconductor wafer 201 and second semiconductor wafer203 on the second wafer chuck 103.

FIG. 5 illustrates a removal of the bonded first semiconductor wafer 201and second semiconductor wafer 203 from the second wafer chuck 103. Inan embodiment in which the second openings 115 are utilized to hold thesecond semiconductor wafer 203 to the second wafer chuck 103, the secondvacuum pump 117 may be turned off and an atmospheric pressure may beallowed to enter the second openings 115. Once the pressure has risen inthe second openings 115, the bonded first semiconductor wafer 201 andsecond semiconductor wafer 203 may be removed from the second waferchuck 103.

FIG. 5 additionally illustrates an infrared (IR) measurement that can beperformed to check the alignment of the bonding. In an embodiment IRenergy 501 is directed through the first semiconductor wafer 201 or thesecond semiconductor wafer 203 to the first alignment marks 205 and thesecond alignment marks 207 and the misalignment of the first alignmentmarks 205 and the second alignment marks 207 may be measured.

However, due to the use of curved surfaces on both the first wafer chuck101 and the second wafer chuck 103, along with the pre-warping of thefirst semiconductor wafer 201 and the second semiconductor wafer 203prior to bonding, the natural warpage of the first semiconductor wafer201 and the second semiconductor wafer 203 (also known as run-out) thatoccurs and impairs the alignment accuracy of the bonding process can beminimized. For example, in an embodiment the alignment accuracy shift inboth the X direction and the Y direction for a bonding process asdiscussed above may be reduced to less than 0.5 μm by 40 μm.

In accordance with an embodiment, a method of bonding wafers comprisingwarping a first wafer prior to bonding to form a warped first wafer isprovided. A second wafer is warped prior to bonding to form a warpedsecond wafer. The first warped wafer is bonded to the second warpedwafer.

In accordance with another embodiment, a method of bonding waferscomprising placing a first wafer onto a first wafer chuck, wherein thefirst wafer chuck warps the first wafer, and placing a second wafer ontoa second wafer chuck, wherein the second wafer chuck warps the secondwafer. The first wafer and the second wafer are placed into contact witheach other.

In accordance with yet another embodiment, a wafer bonding systemcomprising a first wafer chuck with a first curved surface is provided.A second wafer chuck has a second curved surface, the first wafer chuckand the second wafer chuck being movable relative to each other.

Although the present disclosure and its advantages have been describedin detail, it should be understood that various changes, substitutionsand alterations can be made herein without departing from the spirit andscope of the disclosure as defined by the appended claims. For example,different types of materials and processes may be varied while remainingwithin the scope of the present disclosure.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present embodiments, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present disclosure. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, or steps.

What is claimed is:
 1. A method of bonding wafers, the methodcomprising: placing a first wafer in physical contact with a firstsurface, the first surface being glass; initiating a first vacuum pumpand suctioning the first wafer onto the first surface, the first surfacehaving a first curvature; placing a second wafer in physical contactwith a second surface; initiating a second vacuum pump to suction thesecond wafer onto the second surface, the second surface having a secondcurvature, the first surface and the second surface being curved bothprior to and after the initiating the first vacuum pump and theinitiating the second vacuum pump; and bonding the first wafer to thesecond wafer.
 2. The method of claim 1, wherein the bonding the firstwafer to the second wafer further comprises placing a first point of thefirst wafer in physical contact with a second point of the second wafer.3. The method of claim 2, wherein the bonding the first wafer to thesecond wafer further comprising turning off the first vacuum pump afterthe placing the first point of the first wafer in physical contact withthe second point of the second wafer.
 4. The method of claim 1, furthercomprising modifying a first temperature of the first wafer using afirst temperature controller.
 5. The method of claim 4, furthercomprising modifying a second temperature of the second wafer using asecond temperature controller.
 6. The method of claim 1, wherein thefirst surface has a deformation of about 3 μm from a center of the firstsurface to an edge of the first surface.
 7. A method of bonding wafers,the method comprising: placing a first wafer with a plurality of dies inphysical contact with a first curved surface of silicon oxide, siliconnitride, glass, or aluminum oxide; placing a second wafer in physicalcontact with a second curved surface of the first curved surface havinga smaller curvature than the second curved surface; initiating a firstvacuum, wherein both the first curved surface and the second curvedsurface are curved both prior to and after the initiating the firstvacuum, the first wafer being a first semiconductor wafer; measuring analignment between the first wafer and the second wafer, wherein themeasuring the alignment is performed while the first wafer is warped onthe first curved surface and while the second wafer is warped on thesecond curved surface; and placing the first wafer and the second waferinto contact with each other.
 8. The method of claim 7, wherein thefirst curved surface has a deformation of about 3 μm from a center ofthe first curved surface to an edge of the first curved surface.
 9. Themethod of claim 7, further comprising suctioning the first wafer to thefirst curved surface.
 10. The method of claim 9, further comprisingsuctioning the second wafer to the second curved surface.
 11. The methodof claim 7, further comprising modifying a first temperature of thefirst curved surface using a first temperature controller.
 12. Themethod of claim 11, wherein the first temperature controller comprises athermal plate.
 13. A method of bonding wafers, the method comprising:initiating a first vacuum to adhere a first semiconductor wafer to afirst curved surface of a first wafer chuck, the first curved surfacebeing curved both prior to and after the initiating the first vacuum,the first curved surface comprising silicon oxide, the firstsemiconductor wafer in physical contact with the first curved surface;initiating a second vacuum to adhere a second semiconductor wafer to asecond curved surface of a second wafer chuck, the second curved surfacebeing curved both prior to and after the initiating the second vacuum;and moving the first wafer chuck relative to the second wafer chuck tocontact the first semiconductor wafer to the second semiconductor wafer.14. The method of claim 13, further comprising modifying a firsttemperature of the first semiconductor wafer using a first temperaturecontroller.
 15. The method of claim 14, wherein the first temperaturecontroller comprises a thermal plate.
 16. The method of claim 13,wherein the first wafer chuck has a first length of between about 250 mmand about 300 mm.
 17. The method of claim 13, further comprisingaligning the first semiconductor wafer to the second semiconductorwafer.
 18. The method of claim 17, wherein the aligning the firstsemiconductor wafer to the second semiconductor wafer comprisingdirecting infrared energy towards the first semiconductor wafer.
 19. Themethod of claim 13, wherein the first curved surface has a deformationof about 3 μm from a center of the first curved surface to an edge ofthe first curved surface.
 20. The method of claim 13, wherein the movingthe first wafer chuck places a first point of the first semiconductorwafer in physical contact with a second point of the secondsemiconductor wafer.